SKorea's Hynix develops new wafer packaging technology cutting cost by 20 pct |
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Published
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Thu, 18 Jan 2007 03:30
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SEOUL (XFN-ASIA) - Hynix Semiconductor Inc said it has developed a new technology for wafer packaging which will cut the production cost by over 20 pct.'The wafer level package technology enables volume packaging and enhances processing speed, slashing the cost by more than 20 pct from the existing packaging method,' the company said in a statement.Hynix has used the technology for its 2GB DDR2 PC-used memory chip modules.eunkyung.seo@xinhuafinance.com
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